GaAs MOSFETs using Ga/sub 2/O/sub 3/(Gd/sub 2/O/sub 3/) as gate dielectric

M. Hong
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Abstract

Growth of an oxide mixture, Ga/sub 2/O/sub 3/(Gd/sub 2/O/sub 3/), in ultra-high vacuum, on clean and ordered GaAs[100] surface has produced atomically smooth oxide/GaAs interfaces with a low interfacial density of states. Both enhancement-mode p- and n-channel GaAs metal oxide semiconductor field effect transistors (MOSFETs) on GaAs semi-insulating substrates with inversion were demonstrated using this novel oxide as the gate dielectric and a conventional ion-implant technology. Depletion-mode GaAs MOSFETs with accumulation were also fabricated. The Ga/sub 2/O/sub 3/(Gd/sub 2/O/sub 3/) films with thickness varying from 500 to 50 /spl Aring/ show a low leakage current density of 10/sup -9/ A/cm/sup 2/ at low gate bias up to 2.5 V, and electrical breakdown fields of >10 MV/cm.
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采用Ga/sub 2/O/sub 3/(Gd/sub 2/O/sub 3/)作为栅极电介质的GaAs mosfet
在超高真空条件下,在清洁有序的GaAs[100]表面生长Ga/sub 2/O/sub 3/(Gd/sub 2/O/sub 3/)氧化物混合物,产生了具有低界面态密度的原子光滑的氧化物/GaAs界面。采用这种新型氧化物作为栅极介质和传统的离子植入技术,在GaAs半绝缘衬底上实现了增强模式p沟道和n沟道GaAs金属氧化物半导体场效应晶体管(mosfet)。此外,还制备了累加耗尽型GaAs mosfet。Ga/sub 2/O/sub 3/(Gd/sub 2/O/sub 3/)薄膜厚度为500 ~ 50 /spl Aring/,在低栅极偏压达2.5 V时,泄漏电流密度为10/sup -9/ a/ cm/sup 2/,击穿场>10 MV/cm。
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