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1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)最新文献

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Silicon nano-crystals based MOS memory and effects of traps on charge storage characteristics 基于硅纳米晶体的MOS存储器及其陷阱对电荷存储特性的影响
Y. Shi, S. Gu, X. L. Yuan, Y.D. Zheng, K. Saito, H. Ishikuro, T. Hiramoto
MOS memory device with a silicon nanocrystal based floating gate on a very narrow channel has been fabricated. Large threshold voltage shifts of up to 1V are obtained by applying a small electric field to the tunnel oxide for write/erase operation. Furthermore, charge storage characteristics have been investigated in the MOS diodes, where various interface traps and defects were introduced by thermal annealing treatment.
制备了一种基于硅纳米晶浮栅的极窄通道MOS存储器件。通过对隧道氧化物施加小电场进行写/擦除操作,可以获得高达1V的大阈值电压偏移。此外,我们还研究了通过热退火处理引入各种界面陷阱和缺陷的MOS二极管的电荷存储特性。
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引用次数: 5
Sampling methodology for SEM-based defect classification: risk, cost, and benefit analysis 基于sem的缺陷分类的抽样方法:风险、成本和效益分析
R. Akella, Chih-Hung Lin, Prasanna R. Chitturi
The current paper analyzes the relative merits of optical and SEM-based defect classification systems, the needs and costs associated with these systems, and the factors limiting the usability of these systems. In particular, we consider the impact of throughput rate and classification accuracy, on excursion detection and the resulting economic benefits. The paper includes a discussion of these models and a comparison is made to obtain the maximum benefits from existing optical and SEM review and classification methodologies. Scenarios for 0.25 micron fabs are used to indicate the procedures and policies that are the most effective from a fab economic perspective.
本文分析了基于光学和基于扫描电镜的缺陷分类系统的相对优点,与这些系统相关的需求和成本,以及限制这些系统可用性的因素。我们特别考虑了吞吐量和分类精度对偏移检测和由此产生的经济效益的影响。本文对这些模型进行了讨论,并进行了比较,以便从现有的光学和扫描电镜审查和分类方法中获得最大的好处。0.25微米晶圆厂的场景用于表明从晶圆厂经济角度来看最有效的程序和政策。
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引用次数: 0
Design and fabrication for inertial micro sensors 惯性微传感器的设计与制造
Guoying Wu, Zhixiong Xiao, Zhihong Li, Y. Hao
This paper mainly reviews the design rules and working principles of the main inertial sensors, which include the accelerometer and gyroscope, and the main micromachining technology used at the present time. The main research projects on the inertial sensors at the Institute of Microelectronics, Peking University, have been also illustrated.
本文主要综述了加速度计和陀螺仪等主要惯性传感器的设计规律和工作原理,以及目前采用的主要微加工技术。介绍了北京大学微电子研究所惯性传感器的主要研究项目。
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引用次数: 2
An advanced structural deep-submicron MOS device 一种先进的结构深亚微米MOS器件
Zhao Yibing, Laihui, Li Zhizheng, Wu Dexin
An advanced structural deep sub-micron MOS device was presented and fabricated based on conventional photolithography equipment and novel side-wall technique. The effective channel length of 0.2 /spl mu/m could be reached. The transconductances of the optimized devices were 125 and 80 mS/mm for n-MOSFET and p-MOSFET respectively. The breakthrough voltages were 10 and 11 volt respectively for n-MOSFET and p-MOSFET.
在传统光刻设备和新型侧壁技术的基础上,提出并制备了一种结构先进的深亚微米MOS器件。有效通道长度可达0.2 /spl mu/m。优化后的n-MOSFET和p-MOSFET的跨导分别为125和80 mS/mm。n-MOSFET和p-MOSFET的突破电压分别为10伏和11伏。
{"title":"An advanced structural deep-submicron MOS device","authors":"Zhao Yibing, Laihui, Li Zhizheng, Wu Dexin","doi":"10.1109/ICSICT.1998.785851","DOIUrl":"https://doi.org/10.1109/ICSICT.1998.785851","url":null,"abstract":"An advanced structural deep sub-micron MOS device was presented and fabricated based on conventional photolithography equipment and novel side-wall technique. The effective channel length of 0.2 /spl mu/m could be reached. The transconductances of the optimized devices were 125 and 80 mS/mm for n-MOSFET and p-MOSFET respectively. The breakthrough voltages were 10 and 11 volt respectively for n-MOSFET and p-MOSFET.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127169552","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fault detection for mixed signal ICs by current integration 基于电流积分的混合信号集成电路故障检测
Peng Xinguang
A fault detection method for mixed signal integrated circuits by the current integral is proposed. Monitoring the integral of the supply current is specially used for real time, batch testing for mixed signal integrated circuits because additional computation and comparing the obtained current waveforms with the free fault current do not required. Two bit parallel comparison CMOS AD converter is adopted as the circuit under test. The integral of the supply current is only monitored during one clock period when the input stimulus is applied, determining whether the circuit is free fault.
提出了一种基于电流积分的混合信号集成电路故障检测方法。由于不需要额外的计算和将得到的电流波形与自由故障电流进行比较,因此对电源电流积分的监测特别适用于混合信号集成电路的实时、批量测试。被测电路采用二位并行比较CMOS AD转换器。当输入刺激被施加时,电源电流的积分仅在一个时钟周期内被监测,以确定电路是否为自由故障。
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引用次数: 0
VLSI interconnect process integration VLSI互连工艺集成
T. Kikkawa
This paper describes VLSI interconnect process integration with respect to ULSI scaling. Both resistivity and capacitance are key factors for materials used in the interconnect process integration. In order to reduce parasitic resistances of sub-quarter micron CMOS transistors, salicide technologies have been developed for gate and source/drain electrodes. Copper interconnects and low-k interlayer dielectrics, in conjunction with CMP planarization, have been developed to reduce RC delay for future scaled ULSIs.
本文描述了VLSI互连过程集成方面的ULSI缩放。电阻率和电容都是互连过程集成中所用材料的关键因素。为了降低亚四分之一微米CMOS晶体管的寄生电阻,人们开发了用于栅极和源极/漏极的盐化物技术。铜互连和低k层介电体,结合CMP平面化,已经开发出来,以减少未来规模ulsi的RC延迟。
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引用次数: 3
Silicon optical information sensors 硅光信息传感器
Chunyan Wang, F. Devos
We present an approach to design and implementation of silicon optical information sensor using VLSI technology which is not tuned for this purpose.
我们提出了一种使用VLSI技术设计和实现硅光学信息传感器的方法,该技术并未为此目的进行调整。
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引用次数: 0
A novel switched-current sorter based on magnitude 一种基于幅值的新型开关电流分选器
Lin Gu, Shi Bingxue
A novel switched-current mode sorter based on magnitude is proposed. In this sorter, switched-current circuit is used to track/hold input signals. Symmetric winner-take-all network is employed to find maximum current. Then, sorted currents based on magnitude are outputted in time-shared way. This sorter has a simple and flexible structure. It has wide current input/output range. Results of experiment show that the deviation of output current from the corresponding input current is small and the sorting resolution is high.
提出了一种基于幅值的开关电流模式分选器。在该分选器中,开关电流电路用于跟踪/保持输入信号。采用对称赢者通吃网络寻找最大电流。然后,以分时方式输出基于幅度的分选电流。该分选机结构简单灵活。具有宽电流输入/输出范围。实验结果表明,输出电流与相应输入电流的偏差小,分选分辨率高。
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引用次数: 3
Physical properties of semiconducting transition metal silicides and their prospects in Si-based device applications 半导体过渡金属硅化物的物理性质及其在硅基器件中的应用前景
H. Lange
Semiconducting transition metal silicides are of interest as potential candidates for new Si-based devices. The recent advances obtained on the understanding of the physical properties of this group of materials are summarized with special emphasis on /spl beta/-FeSi/sub 2/. Characteristic features of the electronic structure are outlined. Interband and infrared optical properties are in good agreement with theoretical predictions. Light emission could be observed from implanted /spl beta/-FeSi/sub 2/ layers only. Incorporation of corresponding dopants gives n- and p-type material. Carrier interaction with nonpolar optical and acoustic phonons as well as neutral impurities has to be taken into account. The problems and prospects of application of semiconducting silicides are discussed.
半导体过渡金属硅化物是新型硅基器件的潜在候选物。综述了近年来对该类材料物理性质的研究进展,重点介绍了/spl β /-FeSi/sub 2/。概述了电子结构的特征特征。带间和红外光学性质与理论预测一致。只有植入/spl β /-FeSi/sub - 2/层可以观察到光发射。相应掺杂剂的掺入得到n型和p型材料。载流子与非极性光学和声学声子以及中性杂质的相互作用必须考虑在内。讨论了半导体硅化物存在的问题及应用前景。
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引用次数: 1
Electronic structure and properties of novel thermoelectrics from first principles calculations 基于第一性原理计算的新型热电材料的电子结构和性质
D. Singh
The application of first principles calculations based on density functional theory to novel thermoelectric materials is discussed. These calculations give an understanding of the electronic structure and transport coefficients that is often complementary to the view provided by experimental characterization efforts, and which is often useful in identifying promising materials and guiding their optimization. This is illustrated by examples in the skutterudites.
讨论了基于密度泛函理论的第一性原理计算在新型热电材料中的应用。这些计算提供了对电子结构和输运系数的理解,通常是对实验表征工作提供的观点的补充,并且通常有助于识别有前途的材料并指导其优化。这一点可以从skutterudites的例子中得到说明。
{"title":"Electronic structure and properties of novel thermoelectrics from first principles calculations","authors":"D. Singh","doi":"10.1109/ICSICT.1998.786462","DOIUrl":"https://doi.org/10.1109/ICSICT.1998.786462","url":null,"abstract":"The application of first principles calculations based on density functional theory to novel thermoelectric materials is discussed. These calculations give an understanding of the electronic structure and transport coefficients that is often complementary to the view provided by experimental characterization efforts, and which is often useful in identifying promising materials and guiding their optimization. This is illustrated by examples in the skutterudites.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128305433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)
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