{"title":"Device charging in shipping packages","authors":"B. Unger","doi":"10.1109/EOSESD.2000.890103","DOIUrl":null,"url":null,"abstract":"Static charges can develop on devices with movement in shipping packages. During subsequent handling or testing operations, an ESD (electrostatic discharge) can result in device failure. Therefore, the materials used to package semiconductor devices should be selected for their ability to minimize charging and damaging ESDs. Some triboelectric charging test results are shown that suggest that some of these device packages contribute to the failure rate at the assembly facilities.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EOSESD.2000.890103","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Static charges can develop on devices with movement in shipping packages. During subsequent handling or testing operations, an ESD (electrostatic discharge) can result in device failure. Therefore, the materials used to package semiconductor devices should be selected for their ability to minimize charging and damaging ESDs. Some triboelectric charging test results are shown that suggest that some of these device packages contribute to the failure rate at the assembly facilities.
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