New spin-on oxycarbosilane low-k dielectric materials with exceptional mechanical properties

D. Geraud, T. Magbitang, W. Volksen, E. Simonyi, R. Miller
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引用次数: 6

Abstract

Bridged oxycarbosilane monomers are excellent precursors for the formation of spin on porous low-k materials using sacrificial pore generators. The measured Young's modulus numbers for the as-synthesized thin films without any post porosity toughening are the highest by far of any that we have observed for porous films generated using the sacrificial porogen route. For a given dielectric constant, the Young's modulus of these oxycarbosilane films are 4-5 times higher than available organosilicates and at least 2 times higher than UV treated organosilicate materials.
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具有优异力学性能的新型自旋氧碳硅烷低k介电材料
桥接氧碳硅烷单体是利用牺牲孔发生器在多孔低k材料上形成自旋的优良前驱体。没有任何孔隙后增韧的合成薄膜的杨氏模量是迄今为止我们观察到的使用牺牲孔隙路径生成的多孔薄膜中最高的。对于给定的介电常数,这些氧碳硅烷薄膜的杨氏模量比现有的有机硅酸盐高4-5倍,比紫外线处理的有机硅酸盐材料高至少2倍。
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