Bonding temperature dependence of GalnAsP/InP wafer grown on directly bonded InP/Si substrate

Masaki Aikawa, T. Nishiyama, Y. Kamada, Xu Han, G. Periyanayagam, Kazuki Uchida, Hirokazu Sugiyama, N. Hayasaka, K. Shimomura
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引用次数: 1

Abstract

Bonding temperature dependence on the surface conditions and optical characteristics of MOVPE grown GalnAsP/InP laser structure using directly bonded InP/Si substrate were studied. We have changed the temperature for bonding InP and Si substrate between 350 and 450 °C. The void density and photoluminescence intensity were examined.
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直接键合InP/Si衬底生长GalnAsP/InP晶圆的键合温度依赖性
研究了直接键合InP/Si衬底的MOVPE生长GalnAsP/InP激光结构的表面条件和光学特性对键合温度的依赖性。我们将InP和Si衬底的键合温度在350到450°C之间改变。检测了材料的空隙密度和光致发光强度。
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