Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating

Abstract

Die-bonding technology using Cu sinter pastes is an attractive and important joint method for power devices operating at higher temperatures. This paper describes the effect of sintering temperatures on die-shear strengths of non-pressure sintered copper (sCu) onto six different metal platings (Cu, Ni, Electroless Ni, Pd, Ag, and Au). The die-shear strengths of sCu on the metal plating under sintering temperatures (225-350 °C) in H2 gas were measured. As the sintering temperatures increased, the shear strengths on the Cu, Ni, and ENi plating increased, whereas those on the Pd, Ag, and Au plating decreased. By analyzing the element distribution on the bonding interfaces using SEM/EDX, it was found that the self- and non-diffusion couples (sCu:Cu, sCu:Ni, sCu:ENi) can keep the high shear strengths and the diffused couples (sCu:Pd, sCu:Ag, sCu:Au) can deteriorate the shear strengths.