{"title":"Higher resolution acoustic images using frequency domain imaging","authors":"J. Semmens, L. W. Kessler","doi":"10.1109/IPFA.2003.1222747","DOIUrl":null,"url":null,"abstract":"FFT frequency domain imaging has been used to reveal features down to only Angstroms in thickness, which is substantially below the accepted wavelength limit of the resolution, in applications such as wafer bonding, flip chips, and MEMS.","PeriodicalId":266326,"journal":{"name":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2003-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2003.1222747","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
FFT frequency domain imaging has been used to reveal features down to only Angstroms in thickness, which is substantially below the accepted wavelength limit of the resolution, in applications such as wafer bonding, flip chips, and MEMS.