Forced-resonance test technique for multiple wirebonds in electronic packages

Abstract

This paper presents a low-cost test technique for testing multiple wirebonds in electronic packages. Multiple wirebonds are commonly used to reduce the net inductance of wirebonds and achieve lower signal transmission losses. However, if one of the wirebonds is broken then it is extremely difficult to identify it. We have developed a low-cost test technique based on the forced-resonance principle for testing multiple wirebonds in electronic packages. A prototype test setup has been built using two test pads with four parallel wirebonds between the test pads. Our test technique was able to identify when one or more wirebonds were broken. This test technique is highly accurate and is a very low-cost alternative when compared to expensive X-ray imaging systems or bond-pull testers.