{"title":"Systems engineering: a summary of electronics packaging techniques available for present and future systems","authors":"S. A. Coogan","doi":"10.1109/ASIC.1990.186112","DOIUrl":null,"url":null,"abstract":"The different microelectronics packaging approaches currently available and in development are summarized for system engineers. Some of the important attributes the various approaches are pointed out. Some of the packaging issues a system engineer should consider when attempting to baseline a packaging approach are discussed. Four major categories of advanced packaging techniques are considered. They are: high I/O single-chip packages, multichip modules, chip-on-board, and monolithic wafer scale integration.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1990.186112","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The different microelectronics packaging approaches currently available and in development are summarized for system engineers. Some of the important attributes the various approaches are pointed out. Some of the packaging issues a system engineer should consider when attempting to baseline a packaging approach are discussed. Four major categories of advanced packaging techniques are considered. They are: high I/O single-chip packages, multichip modules, chip-on-board, and monolithic wafer scale integration.<>
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