Invited talk: Computing beyond the 11nm node: Which devices will we use?

W. Haensch
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Abstract

Summary form only given. The enormous success of Si CMOS technology is based on the economy of scale. Cost is driven down by increasing wafer size and decreasing feature sizes while performance is steadily growing. The pervasive nature of microelectronic can be seen in all aspects of daily life. The industry enjoyed the success story for several decades by simply following the scaling laws. More recently it is realized that increased performance will come at an unacceptable cost of power and conventional CMOS scaling is rapidly coming to an end. The quest for solutions is in full swing how to meet the computational demands for the foreseeable future. Possible solutions are the change of device architecture and the introduction of high mobility materials for the devices to boost performance. Beyond the classical device materials Si, Ge, and some III/V compounds carbon in the form of carbon nano tubes or graphene are suggested as possible alternative candidates for digital applications. Replacing the field effect transistor by a tunnel FET holds the promise of a low power switch that can be realized with conventional channel materials. Moving from electrical charge to other state variables, like for instance spin, might provide new possibilities to meet the computational needs in the future.
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特邀演讲:超越11nm节点的计算:我们将使用哪些设备?
只提供摘要形式。硅CMOS技术的巨大成功是基于规模经济。晶圆尺寸的增加和特征尺寸的减小降低了成本,同时性能也在稳步增长。微电子无处不在的本质可以在日常生活的各个方面看到。几十年来,这个行业仅仅通过遵循比例定律就取得了成功。最近,人们意识到提高性能将以不可接受的功耗成本为代价,传统的CMOS缩放正迅速走向终结。如何在可预见的未来满足计算需求的解决方案正在全面展开。可能的解决方案是改变设备架构和为设备引入高迁移性材料以提高性能。除了经典的器件材料Si, Ge和一些III/V化合物之外,碳纳米管或石墨烯形式的碳被认为是数字应用的可能替代候选材料。用隧道场效应管取代场效应晶体管,有望实现用传统沟道材料实现的低功率开关。从电荷转移到其他状态变量,比如自旋,可能会为满足未来的计算需求提供新的可能性。
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Comparison of passive enforcement techniques for DRAM package models Welcome to the 2013 IEEE WMED A new method for causality enforcement of DRAM package models using discrete hilbert transforms Invited talk: Computing beyond the 11nm node: Which devices will we use? Invited tutorial: Channel equalization: Techniques for high-speed electrical links
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