Portable Multi-Spectral Imaging: Devices, Vertical Integration, and Applications

A. Valdes-Garcia, P. Pepeljugoski, Ivan Duran, J. Plouchart, M. Yeck, Huijuan Liu
{"title":"Portable Multi-Spectral Imaging: Devices, Vertical Integration, and Applications","authors":"A. Valdes-Garcia, P. Pepeljugoski, Ivan Duran, J. Plouchart, M. Yeck, Huijuan Liu","doi":"10.1109/IEDM13553.2020.9372014","DOIUrl":null,"url":null,"abstract":"Recent advances in semiconductor and packaging technologies have accelerated the miniaturization of portable sensing devices including visible-domain cameras, IR cameras, and millimeter-wave (mmWave) radars. Simultaneously, image and sensor data processing capabilities based on Systems-on-Chip (SoCs) have evolved as well to the extent toward the goal of implementing learning-based automatic recognition capabilities. This paper discusses the challenges and opportunities associated with the vertical sensors-to-software integration of portable systems capable of performing multi-spectral imaging, where data from different portions of the EM spectrum is captured, processed, and displayed simultaneously. An example hardware implementation, multi-spectral image data, and potential applications are discussed","PeriodicalId":415186,"journal":{"name":"2020 IEEE International Electron Devices Meeting (IEDM)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM13553.2020.9372014","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Recent advances in semiconductor and packaging technologies have accelerated the miniaturization of portable sensing devices including visible-domain cameras, IR cameras, and millimeter-wave (mmWave) radars. Simultaneously, image and sensor data processing capabilities based on Systems-on-Chip (SoCs) have evolved as well to the extent toward the goal of implementing learning-based automatic recognition capabilities. This paper discusses the challenges and opportunities associated with the vertical sensors-to-software integration of portable systems capable of performing multi-spectral imaging, where data from different portions of the EM spectrum is captured, processed, and displayed simultaneously. An example hardware implementation, multi-spectral image data, and potential applications are discussed
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
便携式多光谱成像:设备、垂直集成和应用
半导体和封装技术的最新进展加速了便携式传感设备的小型化,包括可见域相机、红外相机和毫米波(mmWave)雷达。同时,基于片上系统(soc)的图像和传感器数据处理能力也在朝着实现基于学习的自动识别能力的目标发展。本文讨论了能够执行多光谱成像的便携式系统的垂直传感器到软件集成相关的挑战和机遇,其中来自EM光谱不同部分的数据被同时捕获,处理和显示。讨论了硬件实现示例、多光谱图像数据和潜在应用
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Subband Engineering by Combination of Channel Thickness Scaling and (111) Surface Orientation in InAs-On-Insulator nMOSFETs A Reliability Enhanced 5nm CMOS Technology Featuring 5th Generation FinFET with Fully-Developed EUV and High Mobility Channel for Mobile SoC and High Performance Computing Application Scaling MoS2 NCFET to 83 nm with Record-low Ratio of SSave/SSRef.=0.177 and Minimum 20 mV Hysteresis Future Logic Scaling: Towards Atomic Channels and Deconstructed Chips An Improved Model on Buried-Oxide Damage for Total-Ionizing-Dose Effect on HV SOI LDMOS
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1