C. Hunat, Carolyn Tubulo, Chuen Khiang Wang, R. Liang, N. Suthiwongsunthorn
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Abstract
In this paper we presented methods of optimizing a 17×17mm LFBGA package having improve its electrical performance using an electromagnetic-field software through simulation, particularly on controlled signals (single-end & differential pairs) and high-speed I/O signal traces.
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