B. Wang, Xiaodong Wang, Yulu Chen, Liwei Hou, Wei Xie, M. Pan
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引用次数: 0
Abstract
In this work, the device structure of the mesa-type GaAs:Te blocked-impurity-band detector was designed. The fabrication processes were presented briefly, and optimization of the fabrication processes was investigated. A 3-micron-thick SiO2 film was deposited as resist to substitute for photoresist in the 50-micron-deep mesa etching process. In addition, a bi-layer photoresist lithography technique was adopted to optimize the process of electrode fabrication. It is demonstrated that the device quality can be improved significantly after optimization.
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