Direct-Conversion I-Q Transmitter Front-End for 180 GHz with 80 GHz Bandwidth in 130 nm SiGe

Paul Stärke, Xin Xu, C. Carta, F. Ellinger
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引用次数: 2

Abstract

This work presents an integrated mm-wave transmitter front-end with independent in-phase and quadrature paths for carrier frequencies around 180 GHz. The up-conversion units consist of a double-balanced active mixer with baseband (IF) buffer, local oscillator (LO) driver and RF power amplifier (PA). A passive 90° hybrid generates the quadrature LO signal and a power combiner joins the PA outputs. The IF-to-RF conversion gain is 10 dB, with an RF bandwidth of 80 GHz. The design supports binary and higher order modulation schemes and exhibits an IF input referred 1-dB compression point of −11 dBm. The saturated output power is 3.5 dBm per path and an LO level of −5 dBm is sufficient for an optimal operation. The total power consumption is 151 mW per path. The final chip occupies an area of 1.4 mm2 and is fabricated in a 130 nm SiGe BiCMOS process with a maximum oscillation frequency of 450 GHz. The main application of this circuit is ultra-wideband short-range communication with data rates beyond 100 Gbit/s.
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直接转换I-Q发射器前端180ghz与80ghz带宽在130nm SiGe
这项工作提出了一个集成的毫米波发射机前端,具有独立的同相和正交路径,用于180 GHz左右的载波频率。上转换单元由带基带(IF)缓冲器的双平衡有源混频器、本振(LO)驱动器和射频功率放大器(PA)组成。无源90°混合产生正交LO信号,功率合成器加入PA输出。IF-to-RF转换增益为10 dB, RF带宽为80 GHz。该设计支持二进制和高阶调制方案,中频输入参考1-dB压缩点为- 11 dBm。每条通路的饱和输出功率为3.5 dBm,−5 dBm的LO电平足以达到最佳工作状态。每条路径总功耗为151mw。最终芯片面积为1.4 mm2,采用130 nm SiGe BiCMOS工艺制造,最大振荡频率为450 GHz。该电路主要应用于数据速率超过100gbit /s的超宽带短距离通信。
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