Precision material engineering — An equipment point of view

Abstract

Novel materials and specialty processes are expanding rapidly. Low power high performance devices 3D transistor, packaging and memory drove the demands. Innovation in new manufacturing methods/hardware and new chemistries are required to meet the challenges. Several examples in the past such as Cu metallization evolution and interface cleaning illustrate the efforts how the equipment vendor overcame the more demanding requirements by introducing more hardware control knobs (such as power, RF frequency, B field distribution, temperature zoning), introducing new chemicals (fine control chemical reaction pathway), new physical/chemistry methods (alternative energy form and source) and tempering with new elements. A proper implementation of advanced capabilities heavily depends on the applications. Better understanding of device integration and close working relationship with customers and suppliers can allow more targeted optimization with less iteration time.