A Reflow-capable, Embedded 8Mb STT-MRAM Macro with 9nS Read Access Time in 16nm FinFET Logic CMOS Process

Y. Shih, Chia-Fu Lee, Yen-An Chang, Po-Hao Lee, Hon-Jarn Lin, Yu-Lin Chen, Chieh-Pu Lo, Ku-Feng Lin, T. Chiang, Yuan-Jen Lee, K. Shen, Roger Wang, Wayne Wang, H. Chuang, Eric Wang, Y. Chih, Jonathan Chang
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引用次数: 24

Abstract

In this paper, we present the design and silicon characterization results of an 8Mb STT-MRAM macro in 16nm FinFET Logic CMOS process. The STT-MRAM film stack is carefully designed to achieve both solder-reflow tolerance and short write pulse of 50nS. A merged reference scheme with reverse connected reference cells are proposed for read-disturb immunity. A read access time of 9nS is achieved from -40C to 125C and Vdd=0.8V±10%, making it suitable for high performance MCU applications. Silicon data measurement is presented to demonstrate a logic-process compatible, perpendicular STT-MRAM in 16nm FinFET CMOS process. The bit-error-rate has achieved zero fail-bit-count at 50-percentile for the 8Mb test-chip at wafer level.
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具有回流功能的嵌入式8Mb STT-MRAM宏,在16nm FinFET逻辑CMOS工艺中具有9nS读访问时间
在本文中,我们介绍了在16nm FinFET Logic CMOS工艺中8Mb STT-MRAM宏的设计和硅表征结果。STT-MRAM薄膜堆栈经过精心设计,可实现焊流公差和50nS的短写入脉冲。提出了一种具有反向连接参考单元的合并参考方案,用于抗读干扰。在-40C至125C范围内,Vdd=0.8V±10%,可实现9nS的读访问时间,适用于高性能MCU应用。硅数据测量提出了一个逻辑过程兼容,垂直的STT-MRAM在16nm FinFET CMOS工艺。在晶圆级,8Mb测试芯片的误码率达到了50%的零故障位计数。
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