Calculation of multi-port parameters of electronic packages using a general purpose electromagnetics code

Barry J. Rubin, S. Daijavad
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引用次数: 31

Abstract

A powerful code developed by the authors to solve radiation and scattering problems from arbitrary 3D dielectric-conductor structures is modified to provide the terminal characteristics of arbitrary package structures. By incorporating a general de-embedding procedure to eliminate end effects, Y- and S-parameters can be obtained for 3D transmission-line structures; other parameters such as the C and L matrices can also be obtained. Results for microstrip twin-tee and mesh-plane structures are presented and compared with results already in the literature.<>
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用通用电磁代码计算电子封装的多端口参数
作者开发了一个功能强大的程序,用于解决任意三维介质导体结构的辐射和散射问题,以提供任意封装结构的终端特性。通过引入一般的去嵌入程序来消除末端效应,可以获得三维传输在线结构的Y和s参数;其他参数,如C和L矩阵也可以得到。给出了微带双三通结构和网格平面结构的结果,并与已有文献的结果进行了比较。
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