{"title":"Miniaturized Bandpass Filter Using IPD Technology with a Novel Design Flow","authors":"Jie Liu, Y. Ban","doi":"10.1109/CIRSYSSIM.2018.8525876","DOIUrl":null,"url":null,"abstract":"A model-centered design flow and trade-off of a compact size radio frequency (RF) filter has been presented in this paper, which has advantages of reduced schematic-layout iteration and improved design efficiency. The RF bandpass filter achieves a bandwidth of 300 MHz ranging from 3.3 GHz to 3.6 GHz, a reasonably high return loss, and an insertion loss below 2.7 dB throughout the whole bandwidth. Besides, the proposed design provides good separation from nearby bands, such as: UHF band, Wi-Fi and 2.4 GHz ISM applications. In addition, the influence of wire bonding package has been modeled and simulated, in order to minimize the degradation of package on the overall performance during the probe measurements. The filter is implemented in a high resistivity silicon integrated passive device process, featuring a compact die area of 0.75 mm2, including seal ring at each side of the chip.","PeriodicalId":127121,"journal":{"name":"2018 IEEE 2nd International Conference on Circuits, System and Simulation (ICCSS)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 2nd International Conference on Circuits, System and Simulation (ICCSS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CIRSYSSIM.2018.8525876","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A model-centered design flow and trade-off of a compact size radio frequency (RF) filter has been presented in this paper, which has advantages of reduced schematic-layout iteration and improved design efficiency. The RF bandpass filter achieves a bandwidth of 300 MHz ranging from 3.3 GHz to 3.6 GHz, a reasonably high return loss, and an insertion loss below 2.7 dB throughout the whole bandwidth. Besides, the proposed design provides good separation from nearby bands, such as: UHF band, Wi-Fi and 2.4 GHz ISM applications. In addition, the influence of wire bonding package has been modeled and simulated, in order to minimize the degradation of package on the overall performance during the probe measurements. The filter is implemented in a high resistivity silicon integrated passive device process, featuring a compact die area of 0.75 mm2, including seal ring at each side of the chip.