Thermal modeling of a few-chip module housing a DC-DC power supply

Abstract

To meet the need for future compact, efficient, high-frequency power supplies, a joint R&D effort between Harris Semiconductor and MCC was established to study the enabling technologies necessary to design a Few-Chip Module incorporating a DC-to-DC distributed power supply component set. The module consists of a Harris Power ASIC (PASIC) chip, a Schottky diode, and 12 discrete multilayer ceramic capacitors (MLCs). The package configuration discussed in this paper is a 120-lead 28/spl times/28 mm thermally-enhanced quad flat package (QFP). The package design is briefly reviewed and the thermal characterization results of the QFP implementation are discussed in detail.