High-Density Mounting Technologies for Printed Circuit Boards in Large-Capacity 3.5-inch HDDs

Kota Tokuda, Keiko Kaji, Kiyokazu Ishizaki
{"title":"High-Density Mounting Technologies for Printed Circuit Boards in Large-Capacity 3.5-inch HDDs","authors":"Kota Tokuda, Keiko Kaji, Kiyokazu Ishizaki","doi":"10.23919/ICEP55381.2022.9795567","DOIUrl":null,"url":null,"abstract":"As a consequence of the increase in data storage capacity on hard disk drives(HDDs), there is a growing need for high-density mounting technologies for printed circuit boards(PCBs) installed in them. In particular, flexible printed circuit boards(FPCs) incorporated in HDDs are facing critical issues including not only severe external restrictions but also the difficulty of mounting preamplifier integrated circuits(ICs) due to the increase in the number of pins and the size of packages. From the standpoints of both quality and productivity in HDD manufacturing, it is therefore necessary to optimize the specifications of FPCs from the conceptual design phase. We have been taking the initiative in developing high-density PCB mounting technologies. We are promoting determination of the specifications of key parts at the initial stage of the design phase and optimization of design in consideration of manufacturing quality, mounting process, and reliability, as well as reliability verification tests. These efforts are making a major contribution to the realization of high-density, high-reliability PCBs suitable. In this report, the process of design and the key technology of high-density mounting have been described.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795567","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

As a consequence of the increase in data storage capacity on hard disk drives(HDDs), there is a growing need for high-density mounting technologies for printed circuit boards(PCBs) installed in them. In particular, flexible printed circuit boards(FPCs) incorporated in HDDs are facing critical issues including not only severe external restrictions but also the difficulty of mounting preamplifier integrated circuits(ICs) due to the increase in the number of pins and the size of packages. From the standpoints of both quality and productivity in HDD manufacturing, it is therefore necessary to optimize the specifications of FPCs from the conceptual design phase. We have been taking the initiative in developing high-density PCB mounting technologies. We are promoting determination of the specifications of key parts at the initial stage of the design phase and optimization of design in consideration of manufacturing quality, mounting process, and reliability, as well as reliability verification tests. These efforts are making a major contribution to the realization of high-density, high-reliability PCBs suitable. In this report, the process of design and the key technology of high-density mounting have been described.
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大容量3.5英寸硬盘中印刷电路板的高密度安装技术
由于硬盘驱动器(hdd)上数据存储容量的增加,对安装在其中的印刷电路板(pcb)的高密度安装技术的需求日益增长。特别是,集成在hdd中的柔性印刷电路板(fpc)面临着严峻的问题,不仅包括严格的外部限制,而且由于引脚数量和封装尺寸的增加,安装前置放大器集成电路(ic)也很困难。因此,从硬盘制造的质量和生产力的角度来看,有必要从概念设计阶段优化fpc的规格。我们一直在主动开发高密度PCB安装技术。我们正在推动在设计阶段的初始阶段确定关键部件的规格,并在考虑制造质量、安装工艺和可靠性以及可靠性验证测试的情况下对设计进行优化。这些努力为实现适合的高密度、高可靠性pcb做出了重大贡献。本文介绍了高密度贴片的设计过程和关键技术。
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