{"title":"77GHz Cavity-Backed AiP Array in FOWLP Technology","authors":"S. Mei, Lim Teck Guan, Chai Tai Chong","doi":"10.1109/ectc51906.2022.00022","DOIUrl":null,"url":null,"abstract":"This paper presents a 4×8 AiP array implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for 77GHz high resolution compact multi-functional MIMO radar applications. It features a cavity-backed 3D stacked structure to achieve stable patterns and wide bandwidth. The fabricated sample with a size of 16mm×16mm×0.402mm shows a measured |S11| <-12.2dB, Gain >14dBi and stable patterns with boresight radiations over 77-81GHz.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00022","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
This paper presents a 4×8 AiP array implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for 77GHz high resolution compact multi-functional MIMO radar applications. It features a cavity-backed 3D stacked structure to achieve stable patterns and wide bandwidth. The fabricated sample with a size of 16mm×16mm×0.402mm shows a measured |S11| <-12.2dB, Gain >14dBi and stable patterns with boresight radiations over 77-81GHz.
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