Ultra shallow As profiling before and after spike annealing using medium energy ion scattering

S. Abo, S. Ichihara, T. Lohner, J. Gyulai, F. Wakaya, M. Takai
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Abstract

Ultra shallow arsenic profiles implanted into Si with an energy range from 0.5 to 3 keV to a dose of 8/spl times/10/sup 14/ ions/cm/sup 2/ before and after spike annealing were measured by medium energy ion scattering (MEIS) with a toroidal electrostatic analyzer (TEA). A shift of the peak of arsenic profile to the surface after spike annealing was observed by MEIS measurement. Most of the implanted arsenic atoms were trapped in the native oxide layer after spike annealing.
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采用中能离子散射法对尖峰退火前后的超浅As谱进行分析
利用环形静电分析仪(TEA),采用中能离子散射(MEIS)技术,测定了在峰值退火前后,以8/spl倍/10/sup 14/ ions/cm/sup 2/剂量注入到Si中,能量范围为0.5 ~ 3kev的超浅砷谱。用MEIS法观察到峰退火后砷谱峰向表面移动。经尖峰退火后,注入的砷原子大部分被困在原生氧化层中。
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