TCAD Simulation of Data Retention Characteristics of Charge Trap Device for 3-D NAND Flash Memory

Dongyean Oh, Bonghoon Lee, Eunmee Kwon, Sangyong Kim, G. Cho, Sungkye Park, Seokkiu Lee, Sungjoo Hong
{"title":"TCAD Simulation of Data Retention Characteristics of Charge Trap Device for 3-D NAND Flash Memory","authors":"Dongyean Oh, Bonghoon Lee, Eunmee Kwon, Sangyong Kim, G. Cho, Sungkye Park, Seokkiu Lee, Sungjoo Hong","doi":"10.1109/IMW.2015.7150306","DOIUrl":null,"url":null,"abstract":"We have developed a reliable and predictable TCAD modeling method for retention characteristics of the charge trap NAND Flash device. This modeling method can explain various retention phenomena related to temperature, program pattern, and bake time. The temperature dependency is well described by direct tunneling and thermionic emission, the pattern dependency can be explained by carrier diffusion and the short time retention can be described by the electron-hole dynamics in the storage nitride layer.","PeriodicalId":107437,"journal":{"name":"2015 IEEE International Memory Workshop (IMW)","volume":"342 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Memory Workshop (IMW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMW.2015.7150306","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 18

Abstract

We have developed a reliable and predictable TCAD modeling method for retention characteristics of the charge trap NAND Flash device. This modeling method can explain various retention phenomena related to temperature, program pattern, and bake time. The temperature dependency is well described by direct tunneling and thermionic emission, the pattern dependency can be explained by carrier diffusion and the short time retention can be described by the electron-hole dynamics in the storage nitride layer.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
三维NAND闪存电荷阱器件数据保持特性的TCAD仿真
我们开发了一种可靠且可预测的电荷阱NAND闪存器件保留特性的TCAD建模方法。这种建模方法可以解释与温度、程序模式和烘烤时间有关的各种滞留现象。直接隧穿和热离子发射可以很好地描述温度依赖性,载流子扩散可以解释模式依赖性,存储氮化物层中的电子-空穴动力学可以描述短时间保留。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Technology Trends and Near-Future Applications of Embedded STT-MRAM Junction Optimization for Embedded 40nm FN/FN Flash Memory Thin-Silicon Injector (TSI): An All-Silicon Engineered Barrier, Highly Nonlinear Selector for High Density Resistive RAM Applications Integration and Electrical Evaluation of Epitaxially Grown Si and SiGe Channels for Vertical NAND Memory Applications Critical ReRAM Stack Parameters Controlling Complimentary versus Bipolar Resistive Switching
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1