Photonic packaging using laser/receiver arrays and flexible optical circuits

G. Grimes, J. Markush, Y. Wong, P. Anthony, W. R. Holland, E.G. Priest, C. J. Sherman, S. Peck, D. Muehlner, C. C. Faudskar, J.S. Nyquist, J.S. Helton, G.L. Sonnier, J. Gates, W. Honea, J. R. Bortolini
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引用次数: 10

Abstract

The topic of this paper is a description of how we replaced the discrete optoelectronic and passive optics devices of the optical interconnection system of a DAGS VI-2000 with parallel optical components developed by the OETC. We have demonstrated that the use of parallel optics components, including high density laser transmitters, high density receivers and high density multifiber backplane connectors are compatible with standard electronic packaging technologies for large telecommunications platforms. We have further demonstrated that the use of parallel optics can dramatically increase system capacity with minimal impact on system physical architecture.
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使用激光/接收器阵列和柔性光学电路的光子封装
本文的主题是描述如何用OETC开发的并行光学元件取代DAGS VI-2000光互连系统的分立光电和无源光学器件。我们已经证明,平行光学元件的使用,包括高密度激光发射器、高密度接收器和高密度多光纤背板连接器,与大型电信平台的标准电子封装技术兼容。我们已经进一步证明,使用并行光学可以显著增加系统容量,对系统物理架构的影响最小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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