Photoresist Lifting Induced Oxide Bridge Defects

W. Xia, David Anderson, Felix Lin, Jonathan Cohrs, Shazad Paracha, D. Mahato, Eric Ellis
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Abstract

Oxide Bridge (OX BG) with wafer center signature was found in the back-end-of-line (BEOL) section of IC fabrication. The defect resembled lifted photoresist (PR) pattern and was uncovered to be related with the weak points at the scribe lines surrounding the active die area. The PR lifting OX BG was significantly reduced through optimizing the focus margin as well as fixing the weak points at the scribe lines.
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光刻胶提升引起的氧化桥缺陷
在集成电路制造的后端线(BEOL)部分发现了具有晶圆中心特征的氧化桥(OX BG)。该缺陷类似于揭起的光刻胶(PR)图案,并被发现与围绕主动模具区域的划线处的弱点有关。通过优化聚焦裕度和固定划线处的薄弱环节,PR举升OX BG显著降低。
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