Simulation analyses of carrier dynamics in npn-type GaN-HBTs with different-hole-concentration p-base layers

A. Mase, Yutaka Nikai, Yusuke Iida, Masaya Takimoto, T. Egawa, M. Miyoshi
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Abstract

The device operations of npn-type GaN-based heterojunction bipolar transistors (HBTs) with different-hole-concentration p-base layers were analyzed via the device simulation. The HBTs with a low-hole-concentration (3.0 × 1017 cm−3) p-base layer exhibited anomalous current behavior. The carrier dynamics analyses indicated that enormous hole currents generated via the following steps. First, even at a low base current injection, the depletion layer occupied most of the p-base layer and caused a kind of the punch-through phenomenon. Then, with the increase in the base current injection, large hole currents generated just around the underneath of the emitter layer. Furthermore, the above enormous hole currents were found to be enhanced with the increase in the energy bandgap offset between the emitter and the base layers.
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不同空穴浓度p基层npn型GaN-HBTs载流子动力学模拟分析
通过器件仿真分析了具有不同空穴浓度p基层的npn型氮化镓异质结双极晶体管(hbt)的器件工作特性。具有低空穴浓度(3.0 × 1017 cm−3)p基层的HBTs表现出异常的电流行为。载流子动力学分析表明,通过以下步骤产生了巨大的空穴电流。首先,即使在低基极电流注入时,耗尽层也占据了p基层的大部分,造成了一种穿孔现象。然后,随着基极电流注入的增加,在发射极层的下方周围产生了大的空穴电流。此外,随着发射极与基材间能量带隙偏移量的增加,上述巨大空穴电流也随之增强。
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