Preparation of polycrystalline silicon thin films on glass by aluminiuminduced crystallization

Jieli Chen, Wei-min Shi, Jing Jin, Weiguang Yang, Y. Liao, Yueyang Xu, Linjun Wang, Guang-pu Wei
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引用次数: 3

Abstract

Polycrystalline silicon (p-Si) is well-known as the high-efficency, low-cost, and most ideal material for manufacturing photovoltaic devices. In recent years, excimer-laser annealing (ELA), metal-induced crystallization (MIC) and solidphase crystallization (SPC) methods are employed to crystallize amorphous silicon (a-Si). In this paper, a cheap metal induced crystallization method of fabricating p-Si thin films on an ordinary glass substrate was investigated. In this synthesis process, a-Si thin film has been deposited onto glass substrates by Plasma Enhanced Chemical Vapor Deposition (PECVD), and p-Si thin films have been fabricated by aluminium-induced crystallization (AIC) under nitrogen ambient. The effects of annealing time, annealing temperature on the crystallization of a-Si were investigated by X-ray diffraction (XRD) technique. Our results indicate that annealing temperature over 300°C is necessary for crystallization of a-Si which preferred to orientation crystalline Si(111) and this preferred orientation becomes more obvious as increasing of annealing time and annealing temperature. Meanwhile, the longer annealing time can produce more a-Si crystallize completely under same aluminium thickness and annealing temperature.
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铝诱导结晶法在玻璃上制备多晶硅薄膜
多晶硅(p-Si)是众所周知的高效、低成本、最理想的制造光伏器件的材料。近年来,准激光退火(ELA)、金属诱导结晶(MIC)和固相结晶(SPC)等方法被用于非晶硅(a-Si)的结晶。本文研究了一种在普通玻璃衬底上制备p-Si薄膜的廉价金属诱导结晶方法。在该合成工艺中,采用等离子体增强化学气相沉积法(PECVD)在玻璃衬底上沉积了a-Si薄膜,在氮环境下采用铝诱导结晶法(AIC)制备了p-Si薄膜。采用x射线衍射(XRD)技术研究了退火时间、退火温度对a-Si结晶的影响。结果表明,a-Si的结晶需要300℃以上的退火温度,且随着退火时间和退火温度的增加,a-Si的结晶倾向于取向Si(111)。同时,在相同铝厚度和退火温度下,较长的退火时间可以产生更多的a-Si完全结晶。
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