Current Capabilities/needs and future possibilities of multi-Chip-modules Summary

Abstract

Summary form only given. The state of the art was discussed in terms of costs, densities, speeds, sizes, yields, rework, testing methodologies, and thermal capabilities for the principle production interconnects. Comparisons were made for each of the newer MCM (multichip module) technologies for which data are available. Observations about costs, reworkability, assembly methods, yields, and testing were made to indicate the author's views on where and how costs for MCMs can be driven down to become competitive with existing interconnect systems. >