Study and fabrication of amorphous and microcrystalline silicon-carbon alloys for microelectronic applications

L. Marsal, J. Pallarès, X. Correig, L. Calvo‐Barrio, M. Domínguez, D. Bardes, J. Calderer, R. Alcubilla
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Abstract

Results on amorphous and microcrystalline silicon carbon alloy layers obtained by plasma enhanced chemical vapor deposition are reported. The investigations are focused on the deposition rate and carbon content for different deposition conditions. In order to assess the applicability of silicon carbon alloys films, heterojunctions of amorphous-SiC:H/crystalline Si (a-SiC:H/c-Si) and microcrystalline-SiC:H/crystalline Si (/spl mu/c-SiC:H/c-Si) diodes were fabricated and their current-voltage characteristics were compared. The obtained results indicate that the /spl mu/c-SiC:H/c-Si heterojunction presents electrical properties suitable for heterojunction bipolar transistor fabrication.
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微电子用非晶和微晶硅碳合金的研究与制造
报道了等离子体增强化学气相沉积法制备非晶和微晶硅碳合金层的结果。研究了不同沉积条件下的沉积速率和碳含量。为了评估硅碳合金薄膜的适用性,制作了非晶sic:H/晶Si (a-SiC:H/c-Si)和微晶sic:H/晶Si (/spl mu/c-SiC:H/c-Si)二极管的异质结,并比较了它们的电流-电压特性。结果表明,/spl mu/c-SiC:H/c-Si异质结具有适合制作异质结双极晶体管的电学性能。
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