Design considerations for next generation traction drive IGBT based power modules

Abstract

In the design of a next generation power module for the automotive traction market it was important to consider every aspect of the module design, the package, the interconnection technology and the chip design. This paper describes how the chip was optimized for both reduced losses and improvements in chip interconnections. Short term higher peak junction temperature operation allows for higher output currents. Details on the improvements in packaging with a smaller footprint and lower bus inductance are presented and it is shown how all these improvements combined allow for a lower cost and higher power density solution.