Guangshan Zhang, Miao Song, Rongbin Guo, Yahai Wang, Lei Liu, Jie Yang, Shichao Liu, Yi Yang
{"title":"A Highly Integrated Multi-parameters RF Transceiver Module for Microwave Semiconductor Chip Testing","authors":"Guangshan Zhang, Miao Song, Rongbin Guo, Yahai Wang, Lei Liu, Jie Yang, Shichao Liu, Yi Yang","doi":"10.1109/SSLChinaIFWS49075.2019.9019758","DOIUrl":null,"url":null,"abstract":"The test of microwave semiconductor chip is currently a hot topic. A miniaturized and highly integrated RF (Radio Frequency) module is designed to test microwave semiconductor chip. Similar to the design concept of synthetic instrument which has an open structure with standard bus and software defined radio, the newly designed integrated RF channel technology realize a variety of RF testing functions. It provides a small and highly integrated common hardware platform with a flexible software platform for re-development of control software. This platform is highly integrated with vector signal generation, vector signal analysis, vector network analysis and noise figure analysis, which can achieve a variety of functional test through dynamic reconfiguration and real-time loading. Multi-stage switch and coupler network are used to route reference signals and reflected signals and transmit signals for vector network analysis. The module receives and generates signals with frequency covering 100k~18GHz. It shares baseband FPGA which makes received signals simultaneously replay in generated channels. The bandwidth reaches 500MHz and supports a variety of vector modulated standards. This module provides a perfect solution to the testing system for microwave semiconductor chip.","PeriodicalId":315846,"journal":{"name":"2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SSLChinaIFWS49075.2019.9019758","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The test of microwave semiconductor chip is currently a hot topic. A miniaturized and highly integrated RF (Radio Frequency) module is designed to test microwave semiconductor chip. Similar to the design concept of synthetic instrument which has an open structure with standard bus and software defined radio, the newly designed integrated RF channel technology realize a variety of RF testing functions. It provides a small and highly integrated common hardware platform with a flexible software platform for re-development of control software. This platform is highly integrated with vector signal generation, vector signal analysis, vector network analysis and noise figure analysis, which can achieve a variety of functional test through dynamic reconfiguration and real-time loading. Multi-stage switch and coupler network are used to route reference signals and reflected signals and transmit signals for vector network analysis. The module receives and generates signals with frequency covering 100k~18GHz. It shares baseband FPGA which makes received signals simultaneously replay in generated channels. The bandwidth reaches 500MHz and supports a variety of vector modulated standards. This module provides a perfect solution to the testing system for microwave semiconductor chip.