M. Kamon, N. Marques, L. M. Silveira, Jacob K. White
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引用次数: 23
Abstract
In the past, model order reduction techniques have been successfully employed for 3-D PEEC (Partial Element Equivalent Circuit) interconnect models. This paper explores the difficulties in generating low order models when PEEC-like models include volume filaments to accurately capture skin and proximity effects.
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