The experimental and numerical investigation on shear behaviour of solder ball in a wafer level chip scale package

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI:10.1109/ECTC.2010.5490737

Ye Zhang, Yangjian Xu, Y. Liu, A. Schoenberg

{"title":"The experimental and numerical investigation on shear behaviour of solder ball in a wafer level chip scale package","authors":"Ye Zhang, Yangjian Xu, Y. Liu, A. Schoenberg","doi":"10.1109/ECTC.2010.5490737","DOIUrl":null,"url":null,"abstract":"The shear test under high strain rate is becoming a popular approach to investigate the fracture behaviour of a thermally attached solder ball under different strain rates. However, despite a substantial number of experimental tests being conducted recently, only a few numerical simulation works have been published. The lack of high performance computational analysis methods applicable to the evaluation of such a complex material and mechanical behaviour in solder interconnection, has yielded questionable accuracy of the simulation based on experimental observation. In this study, the experimental results regarding effects of shear loading speed are illustrated, and then three-dimensional explicit finite element analysis is employed to study dynamic responses of solder joints under ball impact testing. Through a three-dimensional explicit element analysis incorporated with a cohesive model, fracturing and fragmentation mechanisms, transient fracturing of the solder joint subjected to high speed impact test is investigated","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2010.5490737","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

Abstract

The shear test under high strain rate is becoming a popular approach to investigate the fracture behaviour of a thermally attached solder ball under different strain rates. However, despite a substantial number of experimental tests being conducted recently, only a few numerical simulation works have been published. The lack of high performance computational analysis methods applicable to the evaluation of such a complex material and mechanical behaviour in solder interconnection, has yielded questionable accuracy of the simulation based on experimental observation. In this study, the experimental results regarding effects of shear loading speed are illustrated, and then three-dimensional explicit finite element analysis is employed to study dynamic responses of solder joints under ball impact testing. Through a three-dimensional explicit element analysis incorporated with a cohesive model, fracturing and fragmentation mechanisms, transient fracturing of the solder joint subjected to high speed impact test is investigated

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晶圆级芯片封装中焊料球剪切特性的实验与数值研究

高应变速率下的剪切试验已成为研究不同应变速率下热附焊球断裂行为的常用方法。然而，尽管最近进行了大量的实验测试，但只发表了少数数值模拟作品。由于缺乏高性能的计算分析方法来评估这种复杂的材料和焊接互连中的力学行为，基于实验观察的模拟的准确性受到质疑。在阐述剪切加载速度对焊点动态响应影响的基础上，采用三维显式有限元分析方法研究了钢球冲击试验下焊点的动态响应。通过结合内聚模型的三维显式有限元分析，研究了高速冲击试验中焊点的瞬态断裂机理

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2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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