{"title":"A novel cell placement algorithm for flexible TFT circuit with mechanical strain and temperature consideration","authors":"Jiun-Li Lin, Po-Hsun Wu, Tsung-Yi Ho","doi":"10.1109/ASPDAC.2013.6509644","DOIUrl":null,"url":null,"abstract":"Mobility is the key device parameter to affect circuit performance in flexible thin-film transistor (TFT) technologies, and it is very sensitive to the change of mechanical strain and temperature. However, existing algorithms only consider the impact of mechanical strain in cell placement of flexible TFT circuit. Without taking temperature into consideration, mobility may be dramatically decreased which leads to circuit performance degradation. This paper presents the first work to reduce the mobility influence caused by the change of both mechanical strain and temperature. Experimental results show that the proposed algorithms can effectively reduce the chip temperature and the influence caused by mobility variation.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2013.6509644","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Mobility is the key device parameter to affect circuit performance in flexible thin-film transistor (TFT) technologies, and it is very sensitive to the change of mechanical strain and temperature. However, existing algorithms only consider the impact of mechanical strain in cell placement of flexible TFT circuit. Without taking temperature into consideration, mobility may be dramatically decreased which leads to circuit performance degradation. This paper presents the first work to reduce the mobility influence caused by the change of both mechanical strain and temperature. Experimental results show that the proposed algorithms can effectively reduce the chip temperature and the influence caused by mobility variation.