{"title":"Wafer bonding tool including dual plasma capability for in-situ sputter etching prior to aligned bonding","authors":"T. Rogers, V. Masteika, R. Santilli","doi":"10.23919/LTB-3D.2017.7947405","DOIUrl":null,"url":null,"abstract":"Surface passivation free direct bonding is emerging as an important wafer bonding technique. We present an innovative approach to removing passivation layers and bonding in a single tool via simultaneous dual plasma treatment.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"150 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947405","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Surface passivation free direct bonding is emerging as an important wafer bonding technique. We present an innovative approach to removing passivation layers and bonding in a single tool via simultaneous dual plasma treatment.
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