Effect of nitrogen-doped GST buffer layer on switching characteristics of conductive-bridging RAM

Seokjae Lim, Sangheon Lee, J. Woo, Daeseok Lee, Jaesung Park, Jeonghwan Song, Kibong Moon, Jaehyuk Park, A. Prakash, H. Hwang
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引用次数: 1

Abstract

We demonstrate the device characteristics of W/Cu/N-GST/Al2O3/Pt conductive-bridging RAM, focusing on the nitrogen-doped Ge2Sb2Te5 buffer layer to realize non-volatile memory applications. The on/off ratio of typical Cu/Al2O3-based CBRAM was improved from 102 to 105 with the N-GST buffer layer. The switching uniformity also improved compared to that of a non-buffer layer device. The improved properties that were realized are attributed to the effects of buffer layer such as controlled Cu-ion injection, internal resistor, and Joule heating confinement during the reset process. Furthermore, to verify the effect of nitrogen on the switching properties, we compared the GST and N-GST buffer layers. We believe that doped nitrogen helped to control Cu-ion injection into the resistive switching layer, and to confine the joule heating during the reset process, enabling a high on/off ratio and improved switching uniformity.
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掺氮GST缓冲层对电导桥接RAM开关特性的影响
我们展示了W/Cu/N-GST/Al2O3/Pt导电桥接RAM的器件特性,重点介绍了氮掺杂的Ge2Sb2Te5缓冲层,以实现非易失性存储应用。N-GST缓冲层使典型Cu/ al2o3基CBRAM的通/关比从102提高到105。与非缓冲层器件相比,开关均匀性也得到了改善。由于缓冲层的作用,如可控的cu离子注入、内部电阻和复位过程中的焦耳加热限制,实现了性能的改善。此外,为了验证氮对开关性能的影响,我们比较了GST和N-GST缓冲层。我们认为,掺杂氮有助于控制cu离子注入到电阻开关层,并限制复位过程中的焦耳加热,从而实现高开/关比和改善开关均匀性。
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