S. Kikuchi, H. Yamamoto, K. Seyama, M. Hirano, K. Moriizumi
{"title":"High performance MCM-D technology","authors":"S. Kikuchi, H. Yamamoto, K. Seyama, M. Hirano, K. Moriizumi","doi":"10.1109/MCMC.1994.292534","DOIUrl":null,"url":null,"abstract":"FUJITSU has developed an MCM-D technology which uses bare chips on composite thin films for mounting CMOS chips with high density and low cost. The first use of this technology is for the K6000 Series business server. This MCM technology can be applied to a wide range of computers, from workstations to mainframes to reduce costs and improve performance. This paper focuses on the MCM packaging technology, MCM substrate technology, cooling technology and numerical analysis technique.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292534","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
FUJITSU has developed an MCM-D technology which uses bare chips on composite thin films for mounting CMOS chips with high density and low cost. The first use of this technology is for the K6000 Series business server. This MCM technology can be applied to a wide range of computers, from workstations to mainframes to reduce costs and improve performance. This paper focuses on the MCM packaging technology, MCM substrate technology, cooling technology and numerical analysis technique.<>
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