C. K. Foong, Wong Shaw Fong, Leong Jenn Seong, H. Yi, L. C. Kan, Kim Kay
{"title":"Investigation of solder bridging failure for molded matrix array package","authors":"C. K. Foong, Wong Shaw Fong, Leong Jenn Seong, H. Yi, L. C. Kan, Kim Kay","doi":"10.1109/IEMT.2012.6521761","DOIUrl":null,"url":null,"abstract":"Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2012.6521761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.
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