{"title":"A 3D circuit model for power distribution networks in complex package structures","authors":"Z. Zhou, X. Huang, M. Tong","doi":"10.1109/EDAPS.2016.7893136","DOIUrl":null,"url":null,"abstract":"We propose a three dimensional circuit model that is used for characterizing big power nets in complex flip chip packages. The model is based on block division of a multilayered package. Besides, the model breaks the package into three parts along the z-dimension according to layer stack ups. The model parameters can be evaluated individually and thus rapidly by using commercial software. The model is easy to maintain and update by reassigning power grid.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"31 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2016.7893136","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We propose a three dimensional circuit model that is used for characterizing big power nets in complex flip chip packages. The model is based on block division of a multilayered package. Besides, the model breaks the package into three parts along the z-dimension according to layer stack ups. The model parameters can be evaluated individually and thus rapidly by using commercial software. The model is easy to maintain and update by reassigning power grid.
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