{"title":"Reliability Analysis of Self-Repairable MEMS Accelerometer","authors":"X. Xiong, Yu-Liang Wu, W. Jone","doi":"10.1109/DFT.2006.54","DOIUrl":null,"url":null,"abstract":"MEMS (micro electromechanical system) yield and reliability have been a very critical issue. In our previous paper, the authors have proposed a self-repairable MEMS comb accelerometer device, and the yield analysis has demonstrated effective yield increase due to the BISR (built-in self-repair) design. In this paper, the authors developed a MEMS reliability model for quantitative assessment of the MEMS reliability analysis. Based on this model, analysis of the reliability of both non-BISR and BISR MEMS comb accelerometers under z-axis shocking environment. Simulation results demonstrate very effective reliability enhancement due to the BISR design. The reliability model can also be applied to other MEMS devices under various failure mechanisms in a similar way","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFT.2006.54","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16
Abstract
MEMS (micro electromechanical system) yield and reliability have been a very critical issue. In our previous paper, the authors have proposed a self-repairable MEMS comb accelerometer device, and the yield analysis has demonstrated effective yield increase due to the BISR (built-in self-repair) design. In this paper, the authors developed a MEMS reliability model for quantitative assessment of the MEMS reliability analysis. Based on this model, analysis of the reliability of both non-BISR and BISR MEMS comb accelerometers under z-axis shocking environment. Simulation results demonstrate very effective reliability enhancement due to the BISR design. The reliability model can also be applied to other MEMS devices under various failure mechanisms in a similar way
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