首页 > 最新文献

2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems最新文献

英文 中文
Employing On-Chip Jitter Test Circuit for Phase Locked Loop Self-Calibration 采用片上抖动测试电路进行锁相环自校准
T. Xia, S. Wyatt, Rupert Ho
In this paper, a new adaptive PLL is implemented. This PLL employs a simple yet effective jitter test circuit to monitor the PLL jitter performance. Additionally, it uses a digital control unit to dynamically adjust the switched loop filter to suppress the jitter. By using this structure, the trade-off between the PLL locking speed and jitter performance can be balanced
本文实现了一种新的自适应锁相环。该锁相环采用简单而有效的抖动测试电路来监测锁相环的抖动性能。此外,它还使用数字控制单元来动态调整开关环路滤波器以抑制抖动。通过使用这种结构,锁相环锁定速度和抖动性能之间的权衡可以得到平衡
{"title":"Employing On-Chip Jitter Test Circuit for Phase Locked Loop Self-Calibration","authors":"T. Xia, S. Wyatt, Rupert Ho","doi":"10.1109/DFT.2006.26","DOIUrl":"https://doi.org/10.1109/DFT.2006.26","url":null,"abstract":"In this paper, a new adaptive PLL is implemented. This PLL employs a simple yet effective jitter test circuit to monitor the PLL jitter performance. Additionally, it uses a digital control unit to dynamically adjust the switched loop filter to suppress the jitter. By using this structure, the trade-off between the PLL locking speed and jitter performance can be balanced","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123855845","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Implicit Critical PDF Test Generation with Maximal Test Efficiency 具有最大测试效率的隐式临界PDF测试生成
Kyriakos Christou, M. Michael, S. Tragoudas
A new framework for generating test sets with high test efficiency (TE) for critical path delay faults (PDFs) is presented. TE is defined as the number of new critical PDFs detected by a generated test. The proposed method accepts as input a set of potentially critical PDFs and generates a compact test set for only the critical PDFs (i.e., non-sensitizable PDFs are effectively dropped from consideration), whilst avoiding any path or segment enumeration. This is done by exploiting the properties of the ISOPs/ZBDD data structure, which is shown to efficiently represent a set of critical paths along with all their associated sensitization test cubes. The experimental results demonstrate that the proposed method is scalable in terms of test efficiency and can generate very compact test sets for critical PDFs
提出了一种新的关键路径延迟故障高测试效率测试集生成框架。TE定义为生成的测试检测到的新的关键pdf的数量。所提出的方法接受一组潜在的关键pdf作为输入,并仅为关键pdf生成一个紧凑的测试集(即,不敏感的pdf被有效地从考虑中删除),同时避免任何路径或段枚举。这是通过利用ISOPs/ZBDD数据结构的属性来实现的,该数据结构可以有效地表示一组关键路径及其所有相关的敏化测试立方体。实验结果表明,该方法在测试效率方面具有可扩展性,可以为关键pdf生成非常紧凑的测试集
{"title":"Implicit Critical PDF Test Generation with Maximal Test Efficiency","authors":"Kyriakos Christou, M. Michael, S. Tragoudas","doi":"10.1109/DFT.2006.34","DOIUrl":"https://doi.org/10.1109/DFT.2006.34","url":null,"abstract":"A new framework for generating test sets with high test efficiency (TE) for critical path delay faults (PDFs) is presented. TE is defined as the number of new critical PDFs detected by a generated test. The proposed method accepts as input a set of potentially critical PDFs and generates a compact test set for only the critical PDFs (i.e., non-sensitizable PDFs are effectively dropped from consideration), whilst avoiding any path or segment enumeration. This is done by exploiting the properties of the ISOPs/ZBDD data structure, which is shown to efficiently represent a set of critical paths along with all their associated sensitization test cubes. The experimental results demonstrate that the proposed method is scalable in terms of test efficiency and can generate very compact test sets for critical PDFs","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125005466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Timing Failure Analysis of Commercial CPUs Under Operating Stress 商用cpu在工作压力下的时序失效分析
Sanghoan Chang, G. Choi
The timing margin of an operating physical device suffers from crosstalk, power supply voltage fluctuation, and temperature variation among other elements. This problem is increasingly pronounced with deep-submicron technology. A conservative testing, binning and marketing policy alleviates the reliability concerns but at a loss of realizable performance of the device. This paper presents a methodology for a more practical estimation of the timing margin through analytical and empirical analysis of noise sources. First, the sources of noise are modeled. Then physical experiments are conducted to measure time-to-failure of the target CPUs under stress. The accelerated test results are used for parameterizing the models to empirically determine the device timing margin under realistic operating conditions. The results indicate that the actual safe-operating region for a set of tested microprocessors is significantly wider than that reported in manufacturer's' specifications for new devices
工作物理设备的时序裕度受到串扰、电源电压波动和其他因素的温度变化的影响。随着深亚微米技术的发展,这个问题越来越明显。保守的测试、启动和营销策略减轻了可靠性问题,但却损失了器件的可实现性能。本文通过对噪声源的分析和实证分析,提出了一种更实用的估计时间裕度的方法。首先,对噪声源进行建模。然后进行了物理实验,测量了目标cpu在压力下的失效时间。利用加速试验结果对模型进行参数化,以经验确定实际工况下的器件时间裕度。结果表明,一组经过测试的微处理器的实际安全操作区域比制造商对新设备的规格报告的范围要宽得多
{"title":"Timing Failure Analysis of Commercial CPUs Under Operating Stress","authors":"Sanghoan Chang, G. Choi","doi":"10.1109/DFT.2006.66","DOIUrl":"https://doi.org/10.1109/DFT.2006.66","url":null,"abstract":"The timing margin of an operating physical device suffers from crosstalk, power supply voltage fluctuation, and temperature variation among other elements. This problem is increasingly pronounced with deep-submicron technology. A conservative testing, binning and marketing policy alleviates the reliability concerns but at a loss of realizable performance of the device. This paper presents a methodology for a more practical estimation of the timing margin through analytical and empirical analysis of noise sources. First, the sources of noise are modeled. Then physical experiments are conducted to measure time-to-failure of the target CPUs under stress. The accelerated test results are used for parameterizing the models to empirically determine the device timing margin under realistic operating conditions. The results indicate that the actual safe-operating region for a set of tested microprocessors is significantly wider than that reported in manufacturer's' specifications for new devices","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114911608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On-Line Mapping of In-Field Defects in Image Sensor Arrays 图像传感器阵列场内缺陷的在线映射
J. Dudas, C. Jung, Linda Wu, G. Chapman, I. Koren, Z. Koren
Continued increase in complexity of digital image sensors means that defects are more likely to develop in the field, but little concrete information is available on in-field defect growth. This paper presents an algorithm to help quantify the problem by identifying defects and potentially tracking defect growth. Building on previous research, this technique is extended to utilize a more realistic defect model suitable for analyzing real-world camera systems. Monte Carlo simulations show that abnormal sensitivity defects are successfully detected by analyzing only 40 typical photographs. Experimentation also indicates that this technique can be applied to imagers with up to 4% defect density, and that noisy images can be diagnosed successfully with only a small reduction in accuracy. Extension to colour imagers has been accomplished through independent analysis of image colour planes
数字图像传感器复杂性的持续增加意味着缺陷更有可能在现场发展,但关于现场缺陷生长的具体信息很少。本文提出了一种算法,通过识别缺陷和潜在地跟踪缺陷的增长来帮助量化问题。在先前研究的基础上,该技术被扩展为利用更现实的缺陷模型来分析真实世界的相机系统。蒙特卡罗模拟表明,仅通过分析40张典型照片就能成功地检测出异常灵敏度缺陷。实验还表明,该技术可以应用于缺陷密度高达4%的成像仪,并且可以成功地诊断噪声图像,仅降低了精度。通过对图像彩色平面的独立分析,实现了对彩色成像仪的扩展
{"title":"On-Line Mapping of In-Field Defects in Image Sensor Arrays","authors":"J. Dudas, C. Jung, Linda Wu, G. Chapman, I. Koren, Z. Koren","doi":"10.1109/DFT.2006.48","DOIUrl":"https://doi.org/10.1109/DFT.2006.48","url":null,"abstract":"Continued increase in complexity of digital image sensors means that defects are more likely to develop in the field, but little concrete information is available on in-field defect growth. This paper presents an algorithm to help quantify the problem by identifying defects and potentially tracking defect growth. Building on previous research, this technique is extended to utilize a more realistic defect model suitable for analyzing real-world camera systems. Monte Carlo simulations show that abnormal sensitivity defects are successfully detected by analyzing only 40 typical photographs. Experimentation also indicates that this technique can be applied to imagers with up to 4% defect density, and that noisy images can be diagnosed successfully with only a small reduction in accuracy. Extension to colour imagers has been accomplished through independent analysis of image colour planes","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129890110","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
The Filter Checker: An Active Verification Management Approach 过滤器检查器:一种主动验证管理方法
Joonhyuk Yoo, M. Franklin
Dynamic verification architectures provide fault detection by employing a simple checker processor that dynamically checks the computations of a complex processor. For dynamic verification to be viable, the checker processor must keep up with the retirement throughput of the core processor. However, the overall throughput would be limited if the checker processor is neither fast nor wide enough to keep up with the core processor. The authors investigate the impact of checker bandwidth on performance. As a solution for the checker's congestion, the authors propose an active verification management (AVM) approach with a filter checker. The goal of AVM is to reduce overloaded verification in the checker with a congestion avoidance policy and to minimize the performance degradation caused by congestion. Before the verification process starts at the checker processor, a filter checker marks a correctness non-criticality indicator (CNI) bit in advance to indicate how likely these pre-computed results are to be unimportant for reliability. Then AVM decides how to deal with the marked instructions by using a congestion avoidance policy. Both reactive and proactive congestion avoidance policies are proposed to skip the verification process at the checker. Results show that the proposed AVM has the potential to solve the verification congestion problem when perfect fault coverage is not needed. With no AVM, congestion at the checker badly affects performance, to the tune of 57%, when compared to that of a non-fault-tolerant processor. With good marking by AVM, the performance of a reliable processor approaches 95% of that of a non-fault-tolerant processor. Although instructions can be skipped on a random basis, such an approach reduces the fault coverage. A filter checker with a marking policy correlated with the correctness non-criticality metric, on the other hand, significantly reduces the soft error rate. Finally, the authors also present results showing the trade-off between performance and reliability
动态验证体系结构通过使用一个简单的检查处理器来动态检查复杂处理器的计算,从而提供故障检测。为了使动态验证可行,检查器处理器必须跟上核心处理器的退役吞吐量。但是,如果检查器处理器既不够快也不够宽,无法跟上核心处理器的速度,那么总体吞吐量就会受到限制。作者研究了检查器带宽对性能的影响。为了解决检查器的拥塞问题,作者提出了一种带有过滤检查器的主动验证管理(AVM)方法。AVM的目标是通过拥塞避免策略减少检查器中的过载验证,并最小化拥塞引起的性能下降。在检查器处理器开始验证过程之前,过滤器检查器会提前标记正确性非临界性指示器(CNI)位,以指示这些预先计算的结果对可靠性不重要的可能性有多大。然后AVM决定如何使用拥塞避免策略来处理标记的指令。提出了被动和主动的拥塞避免策略,以跳过检查器的验证过程。结果表明,在不需要完全故障覆盖的情况下,所提出的AVM具有解决验证拥塞问题的潜力。在没有AVM的情况下,检查器上的拥塞严重影响性能,与非容错处理器相比,其影响高达57%。在AVM标记良好的情况下,可靠处理器的性能接近非容错处理器的95%。尽管可以在随机的基础上跳过指令,这种方法减少了故障覆盖率。另一方面,带有与正确性非临界度量相关的标记策略的过滤器检查器可以显著降低软错误率。最后,作者还展示了性能和可靠性之间权衡的结果
{"title":"The Filter Checker: An Active Verification Management Approach","authors":"Joonhyuk Yoo, M. Franklin","doi":"10.1109/DFT.2006.64","DOIUrl":"https://doi.org/10.1109/DFT.2006.64","url":null,"abstract":"Dynamic verification architectures provide fault detection by employing a simple checker processor that dynamically checks the computations of a complex processor. For dynamic verification to be viable, the checker processor must keep up with the retirement throughput of the core processor. However, the overall throughput would be limited if the checker processor is neither fast nor wide enough to keep up with the core processor. The authors investigate the impact of checker bandwidth on performance. As a solution for the checker's congestion, the authors propose an active verification management (AVM) approach with a filter checker. The goal of AVM is to reduce overloaded verification in the checker with a congestion avoidance policy and to minimize the performance degradation caused by congestion. Before the verification process starts at the checker processor, a filter checker marks a correctness non-criticality indicator (CNI) bit in advance to indicate how likely these pre-computed results are to be unimportant for reliability. Then AVM decides how to deal with the marked instructions by using a congestion avoidance policy. Both reactive and proactive congestion avoidance policies are proposed to skip the verification process at the checker. Results show that the proposed AVM has the potential to solve the verification congestion problem when perfect fault coverage is not needed. With no AVM, congestion at the checker badly affects performance, to the tune of 57%, when compared to that of a non-fault-tolerant processor. With good marking by AVM, the performance of a reliable processor approaches 95% of that of a non-fault-tolerant processor. Although instructions can be skipped on a random basis, such an approach reduces the fault coverage. A filter checker with a marking policy correlated with the correctness non-criticality metric, on the other hand, significantly reduces the soft error rate. Finally, the authors also present results showing the trade-off between performance and reliability","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"500 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132127132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Modified Triple Modular Redundancy Structure based on Asynchronous Circuit Technique 基于异步电路技术的改进三模冗余结构
Gong Rui, Chen Wei, Liu Fang, Dai Kui, W. Zhiying
Two modified triple modular redundancy (TMR) structures based on asynchronous circuit technique are proposed in this paper. Double modular redundancy (DMR) structure uses asynchronous C element to output and keep the correct value of two redundant storage cells. Temporal spatial triple modular redundancy structure with DCTREG (TSTMR-D) uses explicit separated master and slave latch structure of de-synchronous pipeline. Three soft error tolerant 8051 cores with DMR, TMR and TSTMR-D respectively are implemented in SMIC 0.35mum process. Fault injection experiments are also included. The experiment results indicate that DMR structure has a relatively low overhead on both area and latency than TMR, while tolerances SEUs in sequential logic. TSTMR-D structures can tolerance soft errors in both sequential logic and combinational logic with reasonable area and latency overhead
提出了两种基于异步电路技术的改进三模冗余(TMR)结构。双模冗余(DMR)结构采用异步C元输出并保持两个冗余存储单元的正确值。具有DCTREG的时空三模冗余结构(TSTMR-D)采用了显式分离的非同步管道主从锁存结构。采用中芯0.35 mm制程实现了3个软容错8051核,分别为DMR、TMR和TSTMR-D。断层注入实验也包括在内。实验结果表明,DMR结构比TMR结构具有相对较低的面积和延迟开销,并且在顺序逻辑上容忍seu。TSTMR-D结构可以容忍顺序逻辑和组合逻辑中的软错误,并且具有合理的面积和延迟开销
{"title":"Modified Triple Modular Redundancy Structure based on Asynchronous Circuit Technique","authors":"Gong Rui, Chen Wei, Liu Fang, Dai Kui, W. Zhiying","doi":"10.1109/DFT.2006.44","DOIUrl":"https://doi.org/10.1109/DFT.2006.44","url":null,"abstract":"Two modified triple modular redundancy (TMR) structures based on asynchronous circuit technique are proposed in this paper. Double modular redundancy (DMR) structure uses asynchronous C element to output and keep the correct value of two redundant storage cells. Temporal spatial triple modular redundancy structure with DCTREG (TSTMR-D) uses explicit separated master and slave latch structure of de-synchronous pipeline. Three soft error tolerant 8051 cores with DMR, TMR and TSTMR-D respectively are implemented in SMIC 0.35mum process. Fault injection experiments are also included. The experiment results indicate that DMR structure has a relatively low overhead on both area and latency than TMR, while tolerances SEUs in sequential logic. TSTMR-D structures can tolerance soft errors in both sequential logic and combinational logic with reasonable area and latency overhead","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"300 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116363674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Improving Yield and Defect Tolerance in Multifunction Subthreshold CMOS Gates 提高多功能亚阈值CMOS门的良率和缺陷容忍度
K. Granhaug, S. Aunet
This paper presents simulations of 3 different implementations of the minority-3 function, with special focus on mismatch analysis through statistical Monte Carlo simulations. The simulations clearly favors the minority-3 mirrored gate, and a gate-level redundancy scheme, where identical circuits with the same input drive the same output-node, is further explored as a means of increasing fault- and defect-tolerance. Important tradeoffs between supply voltage, redundancy and yield are revealed, and VDD = 175 mV is suggested as a minimum useful operating voltage, combined with a redundancy factor of 2
本文给出了3种不同的minority-3函数实现的仿真,特别关注通过统计蒙特卡罗仿真进行错配分析。模拟明显倾向于少数3镜像门,并且进一步探索了门级冗余方案,其中具有相同输入的相同电路驱动相同输出节点,作为增加故障和缺陷容错性的手段。揭示了电源电压、冗余和产量之间的重要权衡,建议将VDD = 175 mV作为最小有效工作电压,并结合冗余系数2
{"title":"Improving Yield and Defect Tolerance in Multifunction Subthreshold CMOS Gates","authors":"K. Granhaug, S. Aunet","doi":"10.1109/DFT.2006.35","DOIUrl":"https://doi.org/10.1109/DFT.2006.35","url":null,"abstract":"This paper presents simulations of 3 different implementations of the minority-3 function, with special focus on mismatch analysis through statistical Monte Carlo simulations. The simulations clearly favors the minority-3 mirrored gate, and a gate-level redundancy scheme, where identical circuits with the same input drive the same output-node, is further explored as a means of increasing fault- and defect-tolerance. Important tradeoffs between supply voltage, redundancy and yield are revealed, and VDD = 175 mV is suggested as a minimum useful operating voltage, combined with a redundancy factor of 2","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128304148","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Multi-Site and Multi-Probe Substrate Testing on an ATE 在ATE上的多位点和多探针基板测试
Xiaojun Ma, F. Lombardi
This paper presents a novel method that utilizes multi-site and multi-probe facilities in an ATE for substrate testing. The test time for a batch can be considerably reduced by efficiently utilizing an ATE with a number of flying-probes and multiple substrates under test (SUTs). An analytical model that predicts very accurately the batch test time is proposed. This model establishes the optimal multi-site configuration as corresponding to the batch size that allow multiple SUTs to be simultaneously tested on a ATE. Simulation results for an ATE with 12 flying-probe as example of a commercially available tester are provided; for this ATE the proposed method achieves a reduction of 54.66% in test time over a single-site method (at complete coverage of the modeled faults)
本文提出了一种新的方法,利用多点和多探头设备在一个测试基板。通过有效地利用具有多个飞行探针和多个被测基板(sut)的ATE,可以大大缩短批次的测试时间。提出了一种能够准确预测批量试验时间的分析模型。该模型建立了与批量大小相对应的最佳多站点配置,允许在ATE上同时测试多个sut。以市售测试仪为例,给出了带有12个飞探头的ATE的仿真结果;对于这种ATE,所提出的方法在测试时间上比单站点方法减少了54.66%(在完全覆盖建模故障的情况下)。
{"title":"Multi-Site and Multi-Probe Substrate Testing on an ATE","authors":"Xiaojun Ma, F. Lombardi","doi":"10.1109/DFT.2006.45","DOIUrl":"https://doi.org/10.1109/DFT.2006.45","url":null,"abstract":"This paper presents a novel method that utilizes multi-site and multi-probe facilities in an ATE for substrate testing. The test time for a batch can be considerably reduced by efficiently utilizing an ATE with a number of flying-probes and multiple substrates under test (SUTs). An analytical model that predicts very accurately the batch test time is proposed. This model establishes the optimal multi-site configuration as corresponding to the batch size that allow multiple SUTs to be simultaneously tested on a ATE. Simulation results for an ATE with 12 flying-probe as example of a commercially available tester are provided; for this ATE the proposed method achieves a reduction of 54.66% in test time over a single-site method (at complete coverage of the modeled faults)","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127153193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Scan-Based Delay Fault Tests for Diagnosis of Transition Faults 基于扫描的延迟故障测试用于过渡故障诊断
I. Pomeranz, S. Reddy
This paper studies the effect of the type of scan-based delay fault tests used for a circuit on the ability to diagnose delay defects by studying its effect on diagnosis of transition faults. The authors consider enhanced scan tests, skewed-load tests, broadside tests, functional broadside tests, and a combination of skewed-load and broadside tests. The results indicate that while functional broadside tests should be used for fault detection to avoid overtesting, the test set should be extended for fault diagnosis by adding other types of tests. Adding a small number of skewed-load tests is especially useful for diagnosis if enhanced scan is not available
本文通过研究基于扫描的延迟故障测试类型对过渡故障诊断的影响,研究了基于扫描的延迟故障测试类型对电路延迟缺陷诊断能力的影响。作者考虑了增强扫描测试、倾斜负载测试、侧舷测试、功能侧舷测试以及倾斜负载和侧舷测试的组合。结果表明,虽然应该使用功能侧测试进行故障检测以避免过度测试,但应该通过添加其他类型的测试来扩展测试集以进行故障诊断。如果没有增强扫描,添加少量倾斜负载测试对于诊断特别有用
{"title":"Scan-Based Delay Fault Tests for Diagnosis of Transition Faults","authors":"I. Pomeranz, S. Reddy","doi":"10.1109/DFT.2006.56","DOIUrl":"https://doi.org/10.1109/DFT.2006.56","url":null,"abstract":"This paper studies the effect of the type of scan-based delay fault tests used for a circuit on the ability to diagnose delay defects by studying its effect on diagnosis of transition faults. The authors consider enhanced scan tests, skewed-load tests, broadside tests, functional broadside tests, and a combination of skewed-load and broadside tests. The results indicate that while functional broadside tests should be used for fault detection to avoid overtesting, the test set should be extended for fault diagnosis by adding other types of tests. Adding a small number of skewed-load tests is especially useful for diagnosis if enhanced scan is not available","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130765833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Reconfiguration-based Defect Tolerance Method for Nanoscale Devices 基于重构的纳米器件缺陷容限方法
R. Rad, M. Tehranipoor
In this paper, a novel defect tolerance and test method is proposed for highly defect prone reconfigurable nanoscale devices. The method is based on searching for a fault-free implementation of functions in each configurable nanoblock. The proposed method has the advantage of not relying on defect location information (defect map). It also removes the requirement of per chip placement and routing. A simulation tool is developed and several experiments are performed on MCNC benchmarks to evaluate defect tolerance and yield achievable by the proposed method. A greedy search algorithm is also developed in this simulation program that finds a fault-free configuration of each function of an application on a nanoblock of the device. The experiments are performed for different defect rates and under different values of redundancy provided for the device model. The results show that the proposed method can achieve high yields in acceptable amount of test and reconfiguration time under very high defect densities and with minimum amount of redundancy provided in the device
针对高缺陷易发的可重构纳米器件,提出了一种新的缺陷容限和测试方法。该方法基于在每个可配置纳米块中搜索功能的无故障实现。该方法具有不依赖缺陷定位信息(缺陷图)的优点。它还消除了每个芯片放置和路由的要求。开发了仿真工具,并在MCNC基准上进行了多次实验,以评估所提出方法的缺陷容限和良率。该仿真程序还开发了一种贪婪搜索算法,该算法可以在器件的纳米块上找到应用程序的每个功能的无故障配置。实验是在不同的缺陷率和不同的冗余值下为器件模型提供的。结果表明,该方法可以在非常高的缺陷密度和器件中提供的最小冗余的情况下,在可接受的测试和重构时间内获得高产量
{"title":"A Reconfiguration-based Defect Tolerance Method for Nanoscale Devices","authors":"R. Rad, M. Tehranipoor","doi":"10.1109/DFT.2006.10","DOIUrl":"https://doi.org/10.1109/DFT.2006.10","url":null,"abstract":"In this paper, a novel defect tolerance and test method is proposed for highly defect prone reconfigurable nanoscale devices. The method is based on searching for a fault-free implementation of functions in each configurable nanoblock. The proposed method has the advantage of not relying on defect location information (defect map). It also removes the requirement of per chip placement and routing. A simulation tool is developed and several experiments are performed on MCNC benchmarks to evaluate defect tolerance and yield achievable by the proposed method. A greedy search algorithm is also developed in this simulation program that finds a fault-free configuration of each function of an application on a nanoblock of the device. The experiments are performed for different defect rates and under different values of redundancy provided for the device model. The results show that the proposed method can achieve high yields in acceptable amount of test and reconfiguration time under very high defect densities and with minimum amount of redundancy provided in the device","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132491263","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
期刊
2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1