{"title":"Some Considerations of the Gold-Silicon Die Bond Based on Surface Chemical Analysis","authors":"C. E. Hoge, Simon Thomas","doi":"10.1109/IRPS.1980.362957","DOIUrl":null,"url":null,"abstract":"Die bond reliability using gold-silicon eutectic preforms was investigated and related to poor wetting of the integrated circuit and substrate by the alloy melt. Using a Scanning Auger Microprobe (SAM), surface and interfacial structures were analyzed and the conditions for bonding or non-bonding outlined.","PeriodicalId":270567,"journal":{"name":"18th International Reliability Physics Symposium","volume":"218 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1980-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"18th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1980.362957","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
Die bond reliability using gold-silicon eutectic preforms was investigated and related to poor wetting of the integrated circuit and substrate by the alloy melt. Using a Scanning Auger Microprobe (SAM), surface and interfacial structures were analyzed and the conditions for bonding or non-bonding outlined.
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