Cure Kinetics for Conductive Adhesives

Abstract

Conductive adhesives as solder replacement play more and more important role in surface-mounting technology. The magnitude and duration of cure cycle temperature significantly influence the final physical and mechanical properties of the joints. Therefore, a knowledge of the reaction kinetics is essential for relating the physical properties to the extent of reaction of the system. A series of isothermal tests was processed, and the experimentally obtained results were checked against the proposed kinetic model. A modified kinetic model is proposed to describe the rate of degree of cure, and a good agreement was found between modeling and test results.