MBIST and statistical hypothesis test for time dependent dielectric breakdowns due to GOBD vs. BTDDB in an SRAM array

Woongrae Kim, Chang-Chih Chen, Soonyoung Cha, L. Milor
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引用次数: 3

Abstract

In this paper we present Memory Built-In Self-Test (MBIST) diagnosis methodologies for failure analysis of time-dependent breakdown due to gate oxide breakdown (GOBD) and backend time-dependent dielectric breakdown (BTDDB) in an SRAM array. First, a Built-In Self-Test (BIST) system and algorithm detect the breakdown mechanisms and identify the locations of the faulty sites in SRAM cells. Then, probabilities of failure are estimated for BTDDB and GOBD by matching the observed failure rate from BIST and the expected failure distribution functions from system simulations under realistic use scenarios, with different simulated failure rates for BTDDB and GOBD.
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SRAM阵列中由于GOBD与BTDDB引起的时间相关介电击穿的MBIST和统计假设检验
在本文中,我们提出了内存内置自检(MBIST)诊断方法,用于SRAM阵列中栅极氧化物击穿(GOBD)和后端时间相关介电击穿(BTDDB)的时间相关击穿故障分析。首先,内置自检(BIST)系统和算法检测故障机制并确定SRAM单元中故障位点的位置。然后,通过匹配BIST观测到的故障率和系统仿真得到的预期故障率分布函数,对BTDDB和GOBD在实际使用场景下的故障概率进行估计,BTDDB和GOBD的模拟故障率不同。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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