Aurelien Lecavelier des Etangs-Levallois, A. Grivon, D. Baudet, W. Maia, M. Brizoux
{"title":"Reliability analysis of electronic assemblies using electrically conductive adhesive for high-reliability and Harsh environment applications","authors":"Aurelien Lecavelier des Etangs-Levallois, A. Grivon, D. Baudet, W. Maia, M. Brizoux","doi":"10.1109/ESTC.2014.6962846","DOIUrl":null,"url":null,"abstract":"An alternative to lead-free soldering may be Electrically Conductive Adhesives (ECA) that feature lower soldering temperature. However, long-term electrical properties stability and reliability in harsh environment shall be studied. The work presented here is a comprehensive study of ECA second level interconnects characterization under thermal and thermo-mechanical stress for different PCB and component finishing.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962846","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
An alternative to lead-free soldering may be Electrically Conductive Adhesives (ECA) that feature lower soldering temperature. However, long-term electrical properties stability and reliability in harsh environment shall be studied. The work presented here is a comprehensive study of ECA second level interconnects characterization under thermal and thermo-mechanical stress for different PCB and component finishing.
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