Temperature dependency of MOSFET device characteristics in 4H- and 6H-silicon carbide (SiC)

M. Hasanuzzama, S. Islam, L. Tolbert, M.T. Alam
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引用次数: 44

Abstract

An analytical model for lateral MOSFET that includes the effects of temperature variation in 4H- and 6H-SiC poly-type is presented in this paper. The model includes the effect of temperature variation on the threshold voltage, the carrier mobility, the body leakage current, and the drain and source contact region resistances. MOSFET device behavior in 4H-SiC is also simulated and compared with 6H-SiC material system.
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4H-和6h -碳化硅中MOSFET器件特性的温度依赖性
本文提出了一个包含4H-和6H-SiC多晶型温度变化影响的横向MOSFET解析模型。该模型包括温度变化对阈值电压、载流子迁移率、体漏电流以及漏极和源极接触区电阻的影响。模拟了4H-SiC材料体系中MOSFET器件的性能,并与6H-SiC材料体系进行了比较。
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