Gregory K. Arslanian, C. Christine Dong, R. E. Patrick, Bruce Xiang, K. Wathne
{"title":"Fluxless Soldering in Activated Hydrogen Atmosphere","authors":"Gregory K. Arslanian, C. Christine Dong, R. E. Patrick, Bruce Xiang, K. Wathne","doi":"10.23919/IWLPC52010.2020.9375859","DOIUrl":null,"url":null,"abstract":"A novel hydrogen activation technology based on activated hydrogen or electron attachment (EA) is developed for fluxless soldering at ambient pressure and normal soldering temperature. The technology has a potential to be used for a list of applications in the electronics packaging industry and recent work by a joint effort between Air Products and Sikama International on alpha trials of a production-scale furnace for flux-free wafer bump reflow based on electron attachment (EA).","PeriodicalId":192698,"journal":{"name":"2020 International Wafer Level Packaging Conference (IWLPC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Wafer Level Packaging Conference (IWLPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/IWLPC52010.2020.9375859","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A novel hydrogen activation technology based on activated hydrogen or electron attachment (EA) is developed for fluxless soldering at ambient pressure and normal soldering temperature. The technology has a potential to be used for a list of applications in the electronics packaging industry and recent work by a joint effort between Air Products and Sikama International on alpha trials of a production-scale furnace for flux-free wafer bump reflow based on electron attachment (EA).
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