Multi-Physics Simulation of Wafer-to-Wafer Bonding Dynamics

Abstract

In semiconductor direct wafer bonding process, two silicon wafers are mechanically joined together by interfacial adhesion under room conditions. Accurate alignment between the two wafers along the bond interface is critical to achieve high device performances. This paper uses a coupled solid and fluid mechanics simulation model to study the wafer bonding dynamics. The results of this simulation model are studied in detail and compared against experimental data. This simulation model confirms the role of air viscosity in wafer bonding process. This model can help optimize key hardware features to improve process performance such as post-bond distortion.