{"title":"Guided analytic application for interactive flash memory Vt and I-V classification using Spotfire DecisionSite","authors":"S. Shetty, C. Hopper","doi":"10.1109/ASMC.2003.1194495","DOIUrl":null,"url":null,"abstract":"This paper describes techniques to classify I-V curves and analyze resulting Vt distributions using interactive analytical tools developed and deployed for that purpose on a guided analytics platform called DecisionSite, from Spotfire Inc. An interaction between transistor performance and physical layout was characterized using these methods, and layout changes implemented to reduce this effect have significantly increased the level and consistency of device yield for a new flash memory product. The method for analysis has been encapsulated in a process guide, which facilitates sharing this best practice method with other engineering personnel through a centralized DecisionSite server.","PeriodicalId":178755,"journal":{"name":"Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2003.1194495","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes techniques to classify I-V curves and analyze resulting Vt distributions using interactive analytical tools developed and deployed for that purpose on a guided analytics platform called DecisionSite, from Spotfire Inc. An interaction between transistor performance and physical layout was characterized using these methods, and layout changes implemented to reduce this effect have significantly increased the level and consistency of device yield for a new flash memory product. The method for analysis has been encapsulated in a process guide, which facilitates sharing this best practice method with other engineering personnel through a centralized DecisionSite server.