{"title":"Foil covered PACkage (FPAC): a new package concept","authors":"Y. Hotta, H. Sigyo, S. Kondo, S. Oizumi","doi":"10.1109/ECTC.1996.550896","DOIUrl":null,"url":null,"abstract":"This paper describes the Foil covered PACkage (FPAC) technology developed by Nitto Denko. This concept involves using a thin metal foil on the package. Consequently the package can show very high solder resistance. An improvement of the laser marking, a reduction in the warpage of the package are some of the other advantages of this technology. The concept can also be adapted to provide an EMI shield.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.550896","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper describes the Foil covered PACkage (FPAC) technology developed by Nitto Denko. This concept involves using a thin metal foil on the package. Consequently the package can show very high solder resistance. An improvement of the laser marking, a reduction in the warpage of the package are some of the other advantages of this technology. The concept can also be adapted to provide an EMI shield.
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